| 项目 | ITEM | 技术指标TECHNICAL PARAMETER |
| 基材 | Base material | FR4、中TG、高TG、F4B、PTFE、R4350 |
| 层数 | LAYERS | 1-24（层）LAYERS |
| 最大加工面积 单面/双面板 多层板 | Max.Board SizeSingle Sided/Double Sided PCBMultilayer PCB | 610mm×880mm |
| 板厚 | Board Thickness | 0.20-3.2mm |
| 铜厚 | Cu Thickness | 1OZ—6OZ |
| 最小线宽 | Min. Line Width | 2.5mil |
| 最小间距 | Min Space | 2.5mil |
| 最小孔径 | Min Hole Size | 0.15mm |
| 孔壁铜厚 | PTH Wall Thickness | ＞0.020mm |
| 金属化孔径公差 | PTH Hole Dia Tolerance | ±0.076mm |
| 非金属化孔径公差 | Non PTH Hole Dia Tolerance | ±0.05mm |
| 孔位公差 | Hole Position Deviation | ±0.076mm |
| 外形尺寸公差 | Outline Tolerance | ±0.05mm |
| 开槽 | V-cut | 30°/45°/60° |
| 绝缘电阻 | Insulation Resistance | 1012(常态)Normal |
| 抗剥强度 | Peel-off Strength | 1.4N/mm |
| 阻抗公差： | Soldermask Dia Tolerance | ±10% |
| 热冲击测试 | Solderability Test | 280℃（5-8秒） |
| 可燃性 | Flammability | 94v0 |
| 通断测试电压 | E-test Voltage | 50-250v |
| 成品翘曲板度 | Bow/Twist | ≤1% |
| 品质标准 | Quality Standard | IPC-A600F/MIL-STD-105D |
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